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深圳市鴻芯微組科技有限公司
亞微米芯片貼片機(jī)
  • 亞微米芯片貼片機(jī)
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亞微米芯片貼片機(jī)

熱銷榜
  • 產(chǎn)品詳情
  • 脈沖式下加熱平臺共晶焊接    

    Eutectic welding of pulsed lower heating platform


    高頻上加熱溫度曲線式壓焊(金錫、焊片等) 

    High frequency upward heating temperature curve pressure welding (gold tin, welding strip, etc.


    點(diǎn)膠、蘸膠(UV膠或固化膠、銀漿、各種膠水)

    Dispensing and dipping (UV glue or curing glue, silver paste and various glues)


    UV紫外光照射固化

    UV irradiation curing


    各種不同方向的面朝面貼合

    Face to face fit in different directions


    閉環(huán)式視覺定位系統(tǒng)精度為±0.5um

    The accuracy of vertical closed-loop visual positioning system is ± 0.5um


    模塊化設(shè)計以及高集成度的設(shè)備整合度、根據(jù)需要選裝特定模塊,適用于各種復(fù)雜工藝及場合

    Modular design and highly integrated equipment integration, and specific modules can be selected as required, which is suitable for various complex processes and occasions


    基板放置模塊以及芯片拾取吸嘴做到尺寸范圍內(nèi)的無需頻繁更換

    The substrate placement module and chip pick-up nozzle can be within the size range without frequent replacement


    設(shè)備的高精度以及高穩(wěn)定性能可長時間保持

    The high precision and high stability of the equipment can be maintained for a long time


    工藝過程實(shí)時監(jiān)控觀察,清晰明朗的可視化操作極為簡單便捷

    The process is monitored and observed in real time, and the clear visual operation is very simple and convenient


    脈沖式下加熱平臺共晶焊接    

    Eutectic welding of pulsed lower heating platform


    高頻上加熱溫度曲線式壓焊(金錫、焊片等) 

    High frequency upward heating temperature curve pressure welding (gold tin, welding strip, etc.


    點(diǎn)膠、蘸膠(UV膠或固化膠、銀漿、各種膠水)

    Dispensing and dipping (UV glue or curing glue, silver paste and various glues)


    UV紫外光照射固化

    UV irradiation curing


    各種不同方向的面朝面貼合

    Face to face fit in different directions


    閉環(huán)式視覺定位系統(tǒng)精度為±0.5um

    The accuracy of vertical closed-loop visual positioning system is ± 0.5um


    模塊化設(shè)計以及高集成度的設(shè)備整合度、根據(jù)需要選裝特定模塊,適用于各種復(fù)雜工藝及場合

    Modular design and highly integrated equipment integration, and specific modules can be selected as required, which is suitable for various complex processes and occasions


    基板放置模塊以及芯片拾取吸嘴做到尺寸范圍內(nèi)的無需頻繁更換

    The substrate placement module and chip pick-up nozzle can be within the size range without frequent replacement


    設(shè)備的高精度以及高穩(wěn)定性能可長時間保持

    The high precision and high stability of the equipment can be maintained for a long time


    工藝過程實(shí)時監(jiān)控觀察,清晰明朗的可視化操作極為簡單便捷

    The process is monitored and observed in real time, and the clear visual operation is very simple and convenient